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U.S.-China Innovation Survey of Expert Opinion

A Joint Tsinghua-UCSD Project


About the Survey

The U.S.-China Innovation Survey of Expert Opinion provides a unique angle to understanding the gap between the innovative capacity of the United States and China. Administered to industry experts in targeted high-tech industries, the survey highlights each country’s level of innovation, time needed to reach the global technological frontier, and insights into the innovation environment, such as obstacles to innovation.

Using a new survey methodology, the survey is designed around two questions:

  1. What is the gap in innovation between the United States and China?
  2. At what rate is China catching up to the United States (or vice versa)?

Ultimately, the survey contributes to policy discussion and academic research on the advancing technological capabilities of China and factors affecting the success of high-tech industries in both the United States and China. By utilizing a qualitative framework and directly targeting industry experts, the survey goes beyond many traditional indicators (i.e. patent output, R&D expenditures, STEM graduates) that often misrepresent actual innovation levels.

The survey is a joint project between the UC Institute on Global Conflict and Cooperation (IGCC), the University of California San Diego School of International Relations and Pacific Studies (IR/PS), and the Tsinghua University School of Public Policy and Management (SPPM).

For questions or more information about the U.S.-China Innovation Survey of Expert Opinion, please contact Eric Anderson at eanderson@ucsd.edu or 858-534-8049.

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About the Survey

The Survey
Methodology
Survey Timeline
Research Team

Industries

IC Design  
Coming Soon:
Biopharmaceuticals
Electric Vehicles